大容量SiC混合模块“HPnC”
大容量SiC混合模块“HPnC”
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Fuji Electric has been developing the “HPnC” high-current power module to be used with electric railcars and photovoltaic and wind power generation facilities. The chip uses 7th-generation “X Series” technology, enabling it to achieve lower power loss. The package employs an aluminum nitride (AlN) insulating substrate that utilizes a high heat-dissipating member, as well as base materials consisting of magnesium and silicon carbide composite materials (MgSiC). Adopting a laminated structure for the enclosure of the terminal makes the internal inductance decrease to 10 nH. Furthermore, Ultrasonic terminal welding is used to comply with the RoHS directive. With these technologies, the module achieves a high current density, which is 12% greater than the conventional HPM.
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